Metal fusion bonding – Process – Plural joints
Patent
1998-07-31
2000-04-04
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
22818022, 228222, 228 46, H05K 334
Patent
active
060450320
ABSTRACT:
A method of preventing solder reflow of a SMT component (14) attached with solder (22) to a circuit board (10) that subsequently undergoes a wave soldering operation. The method generally entails the use of a thermal shield (18, 28) that is either part of the support structure (12) for the circuit board (10) during the wave soldering operation, or a temporary mask (28) applied directly to a surface of the circuit board (10). In each case, the thermal shield (18, 28) is configured to contact and completely cover a limited surface region of the circuit board (10) directly opposite the SMT component (14). To provide adequate thermal protection, the covered surface region is preferably as large as or larger than the surface area of the component (14). In a preferred embodiment, the perimeter of the thermal shield (18, 28) has a tapered thickness, e.g., a beveled edge, that enables uninterrupted wave soldering of the surface surrounding the thermal shield (18, 28).
REFERENCES:
patent: 3430686 (1969-03-01), Parkison et al.
patent: 4833301 (1989-05-01), Furtek
patent: 5447886 (1995-09-01), Rai
Gullion Douglas E
Longgood Stuart E
Peugh Darrel E
Sozansky Wayne Anthony
Delco Electronics Corp.
Funke Jimmy L.
Heinrich Samuel M.
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