Method of preventing short-circuiting of bonding wires

Details Method of preventing short-circuiting of bonding wires Method of preventing short-circuiting of bonding wires

1992-03-20

1994-05-10

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437217, 437219, 437220, H01L 2156, H01L 2160

Patent

active

053107020

ABSTRACT:
A method of preventing the interconnecting fine wires of a bonded semiconductor devices from moving from their preferred loop position after being bonded in an automatic wire bonder includes the step of automatically transferring the bonded semiconductor device to an insulating station prior to other operations. The interconnecting fine wires are coated in a manner which does not disturb or short the interconnecting wire which are pre-cured or cured before being transferred to a storage rack, or directly to a follow-on process step of a continuous production line.

REFERENCES:
patent: 4821148 (1989-04-01), Kobayashi et al.
patent: 5013688 (1991-05-01), Yamazaki et al.
patent: 5045151 (1991-09-01), Edell
patent: 5053357 (1991-10-01), Lin et al.
patent: 5057457 (1991-10-01), Miyahara et al.

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