Method of preventing aluminum bond pad corrosion during dicing o

Details Method of preventing aluminum bond pad corrosion during dicing o Method of preventing aluminum bond pad corrosion during dicing o

1994-05-26

1995-10-24

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

H01L 21302, H01L 21304, H01L 21463

Patent

active

054610087

ABSTRACT:
A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.

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patent: 4900363 (1990-02-01), Brehm et al.
patent: 5362681 (1994-11-01), Roberts, Jr. et al.
Mayumi, S., "Corrision-Induced Contact Failures in Double-Level Al-Si-Cu Metallization", J. Elect. Soc.
Schwartz, G. C., "Reactive Ion Etching Introduces Corrosion or Al and Al-Cu Films", J. Appl. Phys., Apr. 1981.
S. Mayumi, et al., "Corrision-Induced Contact Failures in Double-Level Al-Si-Cu Metallization", Journal of the Electrochemical Society, v 137, n 6, pp. 1861-1867, (Jun. 1990).
Wen-Yaung Lee, "Reactive Ion Etching Induced Corrision of Al and Al-Cu Films", Journal of Applied Physics, v 52, n 4, pp. 2994-2999, (Apr. 1981).

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