Metal fusion bonding – Process – Using bond inhibiting separating material
Patent
1980-01-07
1981-12-08
Baldwin, Robert D.
Metal fusion bonding
Process
Using bond inhibiting separating material
228 441R, 228157, 228173C, B23K 3102, B23K 3704
Patent
active
043043500
ABSTRACT:
A system for superplastic forming and diffusion bonding of a metal workpiece sandwich between an upper and lower die to form a structural shape wherein a hollow stainless steel pin is in sealed relationship with a hole in the surface of one metal layer and communicates with the interior of the sandwich. The hollow pin extends into a recess in one of the dies and is in sealing relationship with the recess.
REFERENCES:
patent: 1709865 (1929-04-01), Muffly
patent: 1712085 (1929-05-01), Litle, Jr.
patent: 2882588 (1959-04-01), Rieppel et al.
patent: 2987810 (1961-06-01), Campbell
patent: 3018543 (1962-01-01), Beck
patent: 3024525 (1962-03-01), Wisberger
patent: 3045618 (1962-07-01), Adams
patent: 3340101 (1967-09-01), Fields, Jr. et al.
patent: 3346936 (1967-10-01), Miller et al.
patent: 3683487 (1972-08-01), Sherman
patent: 3764174 (1973-10-01), Taninecz
patent: 3895436 (1975-07-01), Summers et al.
patent: 3896648 (1975-07-01), Schertenleib
patent: 3920175 (1975-11-01), Hamilton et al.
patent: 3927817 (1975-12-01), Hamilton et al.
patent: 3934441 (1976-01-01), Hamilton et al.
patent: 4087037 (1978-05-01), Schier et al.
patent: 4197977 (1980-04-01), Deminet
patent: 4220276 (1980-09-01), Weisert et al.
Olivier Lino L.
Paez Carlos A.
Stracquadaini Salvatore
Baldwin Robert D.
Batten, Jr. J. Reed
Grumman Aerospace Corporation
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