Method of pressure bonding a bumped electronic part and an appar

Details Method of pressure bonding a bumped electronic part and an appar Method of pressure bonding a bumped electronic part and an appar

1997-11-20

2000-03-28

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228103, 2281731, B23K 3102, B23K 3112, B21D 3900

Patent

active

060419962

ABSTRACT:
A method of pressure bonding a bumped electronic part using: a tilting mechanism which tiltably supports a suction tool for sucking a bumped electronic part; and locking means for inhibiting a tilting operation of the tilting mechanism. The method includes: a suction step of sucking the bumped electronic part to the suction tool; a step of detecting the position of the bumped electronic part which is sucked to the suction tool, and positioning the bumped electronic part with respect to a substrate, under a state where the tilting operation is inhibited; and a pressure bonding step of pressure bonding bumps of the bumped electronic part which is sucked to the suction tool, to the substrate under a state where the tilting operation is enabled. According to this arrangement, the tilting mechanism is not accidentally swung during the positioning operation, and hence the mounting accuracy is prevented from being impaired.

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