Method of press-working inorganic substrate and press...

Details Method of press-working inorganic substrate and press... Method of press-working inorganic substrate and press...

2005-02-01

2005-02-01

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S479000

Reexamination Certificate

active

06849522

ABSTRACT:
A method of press-working an inorganic substrate, which method uses a vacuum press machine having an air plunger type pressurization system and comprises bringing upper and lower heat plates which have been heated up to a predetermined temperature into contact with a combination set disposed between the upper and lower heat plates after or before the initiation of pressure reduction of a press atmosphere or under a reduced pressure and then carrying out a low pressure loading of from the initiation of pressurization to 0.05 Mpa over 10 seconds or longer and a press machine which is suitable for the above press-working method and which can set and control a low-pressure of 0.02 MPa or lower and comprises an air plunger that works as an air damper when the upper heat plate descends.

REFERENCES:
patent: 4054478 (1977-10-01), Linnon
patent: 5522478 (1996-06-01), Diekwisch
patent: 6008113 (1999-12-01), Ismail et al.
patent: 6036872 (2000-03-01), Wood et al.

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