Method of preparing thin film resistors

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

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427259, 427537, 437 47, 437 60, 437918, 216 67, 216 48, 216 79, H05H 100

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055038786

ABSTRACT:
A method of preparing a patterned thin film resistor that is appropriately used in combination with semiconductor devices. The method comprises a thin film forming step comprising forming a thin film of a compound comprising at least one metal on an oxide film such as a silicon oxide film; a masking step comprising covering a desired area of the thin film by an organic material; a patterning step comprising converting to plasma a gas mixture comprising a fluorine compound gas and oxygen, and removing an area of the thin film, that is not covered by the organic material by exposing it to a gas containing activated fluorine by the plasma conversion; and a removing step comprising removing the organic material remaining on the desired area of the thin film.

REFERENCES:
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patent: 4392992 (1983-07-01), Paulson et al.
patent: 4510178 (1985-04-01), Paulson et al.
patent: 4520342 (1985-05-01), Vugts
patent: 4569742 (1986-02-01), Schuetz
patent: 4591821 (1986-05-01), Paulson et al.
patent: 4682143 (1987-07-01), Chu et al.
patent: 4746896 (1988-05-01), McQuaid et al.
patent: 4758321 (1988-07-01), Vugts
Foreign Patent Document: Japanese 63-216960 dated Sep. 1988, English Abstract, Not Translated.
IBM Technical Disclosure Bulletin, vol. 24, No. 6, Nov. 1981, pp. 2962-2963.

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