Method of preparing silicon wafers

Details Method of preparing silicon wafers Method of preparing silicon wafers

1994-07-26

1996-06-25

Rachuba, Maurina T.

Stone working

Sawing

125 1301, 451 28, 451 41, B28D 100

Patent

active

055290515

ABSTRACT:
Silicon wafers oriented in the (100) crystal planes are sawed from a silicon ingot using the (111) faces on the as drawn silicon ingot as reference planes. The reference planes permit determination of the ingot orientation during the sawing process.

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patent: 4783225 (1988-11-01), Maejima et al.
patent: 4905425 (1990-03-01), Sekigawa et al.
patent: 5279077 (1994-01-01), Miyashita et al.
"Silicon Processing For The VLSI ERA", vol. 1, pp. 8-26. S. Wolf and R. N. Tauber, 1986. Lattice Press.

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