Plastic and nonmetallic article shaping or treating: processes – Gas or vapor deposition of article forming material onto...
Patent
1987-11-18
1989-08-29
Derrington, James
Plastic and nonmetallic article shaping or treating: processes
Gas or vapor deposition of article forming material onto...
264317, C04B 3556
Patent
active
048615331
ABSTRACT:
A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.
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Brochure: "Hughes Puts Automatic Hybrid Bonding In A Whole New Light".
"Microelectronic Manufacturing and Testing" Aug. 1984, pp. 53-55.
Bertin Robert
Miller Michael B.
Moon Burl M.
Post Robert C.
Air Products and Chemicals Inc.
Dannells, Jr. Richard A.
Derrington James
Marsh William F.
Simmons James C.
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