Method of preparing end faces on integrated circuits

Details Method of preparing end faces on integrated circuits Method of preparing end faces on integrated circuits

1999-04-02

2000-10-31

Banks, Derris H.

Stone working

Work supports

451364, B28D 704

Patent

active

061386596

ABSTRACT:
A method and apparatus for preparing end faces of integrated circuit chips using a cutting machine having a straight blade. The apparatus is a wedge shaped block having one surface angled at the desired angle to be imparted to the end face. The one surface has an alignment member thereon for aligning the chip on the top surface, and at least one locating member at the end of the block for positioning the end of the chip relative to the cutting blade. The block has a plurality of bores therein for applying suction to hold the chip on the one surface during cutting with the blade. The method includes the steps of placing a foot or feet on the chip, placing the chip on the block and aligning it and locating it, and applying a force thereto to hold it fixedly in position.

REFERENCES:
patent: 3004766 (1961-10-01), Bryant
patent: 4315494 (1982-02-01), DiPlacido
patent: 4924843 (1990-05-01), Waren

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