Method of preparing end faces on integrated circuits

Stone working – Sawing – Rotary

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125 15, 451541, B28D 104

Patent

active

060559764

ABSTRACT:
A method for preparing operative end faces of integrated circuit chips or dies utilizes a beveled cutting blade to impart a desired contact angle to the operative end faces of the chip. The method includes the steps of mounting feet on the chip, trimming the feet where necessary, mounting the chip on a fixture with tape, cutting the end faces, and removing the chip from the fixture.

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patent: 4217689 (1980-08-01), Fujii et al.
patent: 5029418 (1991-07-01), Bull
patent: 5369060 (1994-11-01), Baumann et al.
patent: 5718615 (1998-02-01), Boucher et al.
patent: 5915370 (1999-06-01), Casper

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