Plastic and nonmetallic article shaping or treating: processes – Forming articles by uniting randomly associated particles – Autogenously or by activation of dry coated particles
Patent
1982-12-20
1984-08-28
Hall, James R.
Plastic and nonmetallic article shaping or treating: processes
Forming articles by uniting randomly associated particles
Autogenously or by activation of dry coated particles
264122, 264112, B27J 500
Patent
active
044683626
ABSTRACT:
This disclosure is directed to the preparation of a self-sustaining hydrophobic backing layer which also possesses excellent electrical conductivity so that it can serve as an intermediate layer between the current distributor and the active layer of a complete oxygen cathode. Said backing layer is formed by a simple process in which an intimate liquid dispersion containing finely divided carbon black and not more than equal parts by weight of PTFE particles ranging in size from about 0.05 to about 0.5 microns is dewatered and shaped into a thin layer which is thereafter lightly pressed and consolidated at elevated temperatures. Preferably, the carbon black is an acetylene black of a particle size range between 50 and 3000 Angstroms and the weight proportion of same is greater than the PTFE.
REFERENCES:
patent: 2782180 (1957-02-01), Weidman
patent: 3281511 (1966-10-01), Goldsmith
patent: 3385780 (1968-05-01), Feng
patent: 4042747 (1977-08-01), Breton et al.
Advances in Chemistry Series, R. F. Gould, Editor, Amer. Chem. Soc., (1969), A Novel Air Electrode, Landi et al, pp. 13-23.
Collins Arthur S.
Diamond Shamrock Corporation
Hall James R.
Harang Bruce E.
LandOfFree
Method of preparing an electrode backing layer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of preparing an electrode backing layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of preparing an electrode backing layer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-876898