Method of preparing a sealed light-emitting diode chip

Details Method of preparing a sealed light-emitting diode chip Method of preparing a sealed light-emitting diode chip

2011-04-26

2011-04-26

Malsawma, Lex (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S127000, C257SE21502

Reexamination Certificate

active

07932108

ABSTRACT:
A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.

REFERENCES:
patent: 7534663 (2009-05-01), Ogawa et al.
patent: 2007/0231469 (2007-10-01), Lin et al.
patent: 2006-165326 (2006-06-01), None

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