Metal treatment – Process of modifying or maintaining internal physical... – Processes of coating utilizing a reactive composition which...
Patent
1998-04-15
2000-09-05
Sheehan, John
Metal treatment
Process of modifying or maintaining internal physical...
Processes of coating utilizing a reactive composition which...
148251, 148275, 148272, 148274, 148276, 148285, C23C 2200
Patent
active
06113709&
ABSTRACT:
The present invention is drawn to a method of lowering the net resistivity of an interconnect by depositing a monomer layer upon an aluminum bonding pad, the treatment thereof to cross link the monomer to form an electrically conductive polymer, and simultaneously, the substantial reduction of alumina, Al.sub.2 O.sub.3, to metallic aluminum. In the method of the present invention, deposition of a monomer layer in a solvent, volatilization of the solvent, and contact with a strong oxidizer such as a potassium permanganate allows for the use of the strong oxidizer without the hindrance of having to deal with a manganese oxide husk on the surface of the aluminum bonding pad. Preferably, the chemical qualities of the monomer will include the tendency to be a reducing agent to the native oxide film of the bonding pad. By selecting a monomer that tends to reduce rather than to oxidize, the problem of thickening the native oxide film is avoided. Another preferred chemical quality of the monomer and its polymer after cross linking, is that it will act as a protective coating to the chip package for substantially all further processing. In particular, the monomer or its cross-linked polymer will act as a protective coating to the chip package during an acid dip in an oxidizer solution such as acidic KMnO.sub.4.
REFERENCES:
Kuechenmeister, et al., "Polypyrrole as an Interlayer for Bonding Conductive Adhesives to Activated Aluminum Bond Pads," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, vol. 20, No. , pp. 9-14, (Mar. 1997).
Vork, et al., "Structural Effects in Polypyrrole Synthesis," Electrochimica Acta, vol. 33, No. 11, pp. 1513-1517 (1988).
Beck, "Review Article: Electrodeposition of Polymer Coatings," Electrochimica Acta,vol. 33, No. 11, pp. 839-850 (1988).
Asavapiriyanont, et al., "The Electrodeposition of Polypyrrole Films From Aqueous Solutions," J. Electroanal. Chem. 177 pp. 229-244 (1984).
Jiang Tongbi
Li Li
Micro)n Technology, Inc.
Oltmans Andrew L.
Sheehan John
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