Method of precisely aligning components in flexible...

Details Method of precisely aligning components in flexible... Method of precisely aligning components in flexible...

2008-04-01

2008-04-01

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

10923612

ABSTRACT:
The present invention is a method of aligning components on a flexible integrated circuit. First a rigid substrate is selected. Next a flexible interconnect is deposited on the substrate, the interconnect preferably consisting of alternating polyimide and metal layers. After depositing the interconnect on the substrate, solder bumps are applied to the interconnect. Next, attach electronic components to the interconnect. A second substrate is then attached to the electronic components. Then, remove the first substrate to expose the interconnect. Last, the second substrate is removed to release the integrated circuit module.

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patent: 7018866 (2006-03-01), Sugaya et al.
patent: 7169652 (2007-01-01), Kimura

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