Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-04-01
2008-04-01
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C257SE21499
Reexamination Certificate
active
07351608
ABSTRACT:
The present invention is a method of aligning components on a flexible integrated circuit. First a rigid substrate is selected. Next a flexible interconnect is deposited on the substrate, the interconnect preferably consisting of alternating polyimide and metal layers. After depositing the interconnect on the substrate, solder bumps are applied to the interconnect. Next, attach electronic components to the interconnect. A second substrate is then attached to the electronic components. Then, remove the first substrate to expose the interconnect. Last, the second substrate is removed to release the integrated circuit module.
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Ferragut Jennifer P.
Geyer Scott B.
The United States of America as represented by the Director of t
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