Method of potting a component

Fluent material handling – with receiver or receiver coacting mea – Fluent charge impelled or fluid current conveyed into receiver

Reexamination Certificate

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Details

C141S066000, C264S102000, C264S500000

Reexamination Certificate

active

07077174

ABSTRACT:
This invention relates to a method of potting a component, namely encasing a component (110) in a potting compound (112) with, optionally, all or some of the voids in the component also being filled with potting compound. In particular, the present invention relates to potting a component that will be subject to high electric field strengths in use. The method comprises introducing an inert gas into a first pressure vessel (100) containing the component to be potted thereby to create an inert environment, introducing a potting compound into the first pressure vessel and allowing the potting compound to cure in the inert environment.

REFERENCES:
patent: 4228832 (1980-10-01), Brown
patent: 4681718 (1987-07-01), Oldham
patent: 5057348 (1991-10-01), Drain et al.
patent: 5670203 (1997-09-01), Terhardt et al.
patent: 2 702 990 (1994-09-01), None
patent: 61 172711 (1986-04-01), None
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patent: 3-281210 (1991-12-01), None
patent: 5-259652 (1993-10-01), None
patent: 8-010582 (1994-07-01), None
patent: 8-064627 (1996-03-01), None
patent: 2000-317975 (2000-11-01), None
patent: 2001-044228 (2001-02-01), None

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