Method of post-processing solid-state imaging device

Details Method of post-processing solid-state imaging device Method of post-processing solid-state imaging device

1996-11-08

2000-04-04

Chang, Joni

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

438 64, 438 67, 438 68, 257724, 2502081, H01L 2100

Patent

active

060460709

ABSTRACT:
A method of post-processing a solid-state imaging device including a wafer processing step 1 (S1), an assembly step 2 (S2) in which packaging is performed, an inspection step 3 (S3), and an annealing step (S4) in which a solid-state having gone through the inspection step 3 is annealed at a predetermined temperature. The method makes it possible to reduce the level of an image defect that occurs after assembly.

REFERENCES:
patent: 4406825 (1983-09-01), Pez et al.
patent: 4745470 (1988-05-01), Yabe et al.
patent: 4895291 (1990-01-01), Ozimek et al.
patent: 4987477 (1991-01-01), Ikeno
patent: 5334829 (1994-08-01), Ueno et al.

Affiliated with

Also associated with

Rating

Method of post-processing solid-state imaging device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of post-processing solid-state imaging device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of post-processing solid-state imaging device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-364424