Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1996-11-04
1998-11-03
Ortiz, Angela Y.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427214, 26427217, 425384, 425402, B29C 3502, B29C 7070
Patent
active
058304037
ABSTRACT:
A post mold curing apparatus for use in association with a molding line system for providing plastic encapsulated semiconductor chips mounted on leadframes is disclosed which includes a leadframe carrier having a rotary, substantially cylindrical shaped assembly for containing and moving a plurality of semiconductor chips and their associated leadframe strips into both an elevated temperature post mold curing region and into a lower temperature cool-down region. Each of the leadframe strips with their associated semiconductor chips are sequentially inserted into cavity regions located in the cylindrical assembly to assist in moving each of the plurality of leadframe strips through the elevated temperature post mold curing region, and subsequently, each of the leadframe strips with their associated semiconductor chips are removed from the cavity regions after passing through the lower temperature cool-down region.
REFERENCES:
patent: 4913930 (1990-04-01), Getson
patent: 5110515 (1992-05-01), Nakamura et al.
Moy Jeffrey D.
Ortiz Angela Y.
Weiss Harry M.
LandOfFree
Method of post mold curing plastic encapsulated semiconductor ch does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of post mold curing plastic encapsulated semiconductor ch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of post mold curing plastic encapsulated semiconductor ch will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-686342