Cutting – With means to monitor and control operation – Including means to correct the sensed operation
Patent
1998-11-20
2000-11-14
Peterson, Kenneth E.
Cutting
With means to monitor and control operation
Including means to correct the sensed operation
8343514, 83421, 836511, 125 21, 125 35, B26D 150
Patent
active
061454222
ABSTRACT:
A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.
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Katamachi Shozo
Shibaoka Shinji
Peterson Kenneth E.
Tokyo Seimitsu Co. Ltd.
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