Method of positioning objects to be measured

Details Method of positioning objects to be measured Method of positioning objects to be measured

1989-11-01

1990-10-30

Werner, Frank E.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

437 8, 437924, 414754, H01L 2166

Patent

active

049665200

ABSTRACT:
A method of positioning a wafer when plural chips arranged on the semiconductor wafer are to be measured by a probe apparatus. The direction in which probes of the probe apparatus are set is measured via a dummy wafer and stored as data. The positioning of the wafer can be achieved by the operation of a table on which the wafer is mounted. When the wafer is to be positioned, the chips-lined direction on the wafer is rotated to align with the moving coordinates of the table and then with the probes-set direction. A probing direction in which wafers are successively moved and a reference position on the wafer are determined, and this reference position is aligned with the position of the probes. Measurement is carried out relative to every position of the chips calculated from the reference position, while moving the table along the probing direction.

REFERENCES:
patent: 4759681 (1988-07-01), Nogami
patent: 4818169 (1989-04-01), Schram et al.

Affiliated with

Also associated with

Rating

Method of positioning objects to be measured does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of positioning objects to be measured, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of positioning objects to be measured will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-272710