Method of positioning lead frame on molding die to seal semicond

Details Method of positioning lead frame on molding die to seal semicond Method of positioning lead frame on molding die to seal semicond

1992-03-27

1994-02-22

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

26427215, 26427217, 425125, 4251261, 425135, 425150, 425171, B29C 3312, B29C 3330

Patent

active

052886980

ABSTRACT:
A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.

REFERENCES:
patent: 3973888 (1976-08-01), Hehl
patent: 4954308 (1990-09-01), Yabe et al.
"Montage Integrierter Schaltungen", H.-J. Hacke, Springer Verlag Berlin (1987), pp. 126-128.
"SMT-die neue Bestuckungstechnik fur Flachbaugruppen", D. Friedrich et al., Siemens Components 24 (1986), vol. 6, pp. 211-221.
"SMD Placement Using Machine Vision", J. Field et al., Electronic Packaging & Production (Jan. 1986) pp. 128-129.
IBM Technical Disclosure Bulletin, vol. 30, No. 10, Mar. 1988.

Affiliated with

Also associated with

Rating

Method of positioning lead frame on molding die to seal semicond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of positioning lead frame on molding die to seal semicond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of positioning lead frame on molding die to seal semicond will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-171138