Method of positioning disk-shaped workpieces, preferably semicon

Photocopying – Projection printing and copying cameras – Methods

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355 41, 355 43, G03B 2732

Patent

active

043765815

ABSTRACT:
In the photoexposure of semiconductor wafers for the production of circuit elements, the wafers are placed in a prealignment position before being transferred to the exposure stage. A chuck acting as a prepositioning stage is rotatable by one servomotor to set the wafer in its appropriate angular position (.phi. adjustment) and is shiftable by respective servomotors in the X and Y directions. Servomotor control is effected by optical means detecting a noncircular edge portion of the wafer as well as alignment marks on the wafer inwardly of the edge thereof.

REFERENCES:
patent: 3844655 (1974-10-01), Johannsmeier
patent: 3930684 (1976-01-01), Lasch, Jr. et al.
patent: 4295735 (1981-10-01), Lacombat et al.

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