Method of positioning and soldering of SMD components

Details Method of positioning and soldering of SMD components Method of positioning and soldering of SMD components

1992-10-19

1995-05-09

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228232, 219 8513, B23K 1005, B23K 3102

Patent

active

054132754

ABSTRACT:
The invention relates to a method of positioning and soldering of electronic components on a printed circuit board. To this end, soldering material is first heated to a suitable molten temperature, after which the component is put in the liquid soldering material with its connections and the soldering material is then allowed to cool. Soldering is preferably carried out in an inert or slightly reducing atmosphere. Heating of the soldering material may take place in a single stage or in two stages.

REFERENCES:
patent: 3436818 (1969-04-01), Merrin et al.
patent: 3617682 (1971-11-01), Hall
patent: 3717743 (1973-02-01), Costello
patent: 3912153 (1975-10-01), Hartleroad et al.
patent: 4160893 (1979-07-01), Meyen et al.
patent: 4312692 (1982-01-01), Ikeda et al.
patent: 4657169 (1987-04-01), Dostoomian et al.
patent: 4696104 (1987-09-01), Vanzetti et al.
patent: 4735354 (1988-04-01), Yagi et al.
patent: 4817851 (1989-04-01), Kolesar et al.
patent: 4909428 (1990-03-01), Mermet-Guyennet

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