Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1993-04-13
1995-06-06
Bradley, P. Austin
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
22818021, 228 9, B23K 3704, B23K 2602
Patent
active
054215064
ABSTRACT:
Method of positioning an object on a carrier, device suitable for carrying out this method, and suction tube suitable for use in the device.
The method is for laser soldering of an electronic component (7) on a pc-board (1). The component is positioned on a contact face (3) of the pc-board (1) by a device comprising a vibration transducer (53, 69, 85) which is brought into mechanical hard contact with the component (7) while the component is held against the pc-board. Subsequently, a laser (205, 207) heats solder present on the contact face and vibrations generated by the laser in the solder are passed on to the vibration transducer while the mechanical hard contact is being maintained. The vibration transducer then checks for the presence of mechanical contact between the object and the carrier and/or the melting of the solder from a comparatively strong decrease in the vibration amplitude during melting of the solder.
REFERENCES:
patent: 3986391 (1976-10-01), Vahaviolos
patent: 4633057 (1986-12-01), Wilson et al.
patent: 4683654 (1987-08-01), Scholten et al.
Metals Handbook, 9th Ed., vol. 6, ASM, Metals Park, Ohio (Aug. 1983) pp. 846, 847, 849-851, 855.
Gieles Antonius C. M.
Kooijman Cornelis S.
Van Veen Nicolaas J. A.
Wesseling Wessel J.
Bartlett Ernestine C.
Bradley P. Austin
Knapp Jeffrey T.
U.S. Philips Corporation
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