Method of positioning a wafer with respect to a focal plane of a

Optics: measuring and testing – By alignment in lateral direction – With light detector

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2502014, G01B 1100

Patent

active

052687449

ABSTRACT:
A method of positioning a surface of a wafer with respect to a focal plane of an optical system is disclosed. The method includes: forming an image of a pattern in a first region of a wafer through the optical system; projecting through the optical system a radiation beam to the first region of the wafer and projecting through the optical system a reflection beam from the first region of the wafer onto a predetermined plane; evaluating the formed image to determine the focal plane of the optical system and determining, as a reference position, a position of incidence on the predetermined plane of the reflection beam from the first region of the wafer at a level corresponding to the determined focal plane; projecting a radiation beam to a second region of the wafer and projecting through the optical system a reflection beam from the second region of the wafer onto the predetermined plane; and positioning the second region of the wafer on the determined focal plane of the optical system on the basis of a position of incidence of the reflection beam from the second region of the wafer with respect to the determined reference position.

REFERENCES:
patent: 4650983 (1987-03-01), Suwa
patent: 4705940 (1987-11-01), Kohno
patent: 4952815 (1990-08-01), Nishi

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