Method of positioning a semiconductor member by examining it and

Details Method of positioning a semiconductor member by examining it and Method of positioning a semiconductor member by examining it and

1977-06-07

1980-04-29

Corbin, John K.

Optics: measuring and testing

For optical fiber or waveguide inspection

250578, 356400, G01N 2132, G01B 1126

Patent

active

042003938

ABSTRACT:
According to the present method of positioning a semiconductor member by examining it, an optical image of the semiconductor member is focussed on a photoelectric conversion face formed by having a plurality of photoelectric conversion elements arranged thereon in the form of a matrix. By means of the photoelectric conversion elements spotlighted by said optical image, the distributions of the spotlighted elements and the remaining non-spotlighted elements are examined through scanning operation. By using the examination results, a table having said semiconductor members loaded thereon is so moved as to permit one of them to fall under the photoelectric conversion face, thereby to inspect for positioning examination of the semiconductor member the presence or absence of a defect-indicating mark affixed thereto and examine the qualification or non-qualification of the member in terms of outer dimension, in terms of the position taken after moved, and in terms of whether or not the semiconductor member can be subjected to correction of the position, or is damaged, or is cracked, or is stained or is partially oversized. Thus, according to the present method, only each qualified one of the semiconductor members can be positioned precisely in a prescribed position, and a die bonding apparatus of the invention is based on the using of the above method for purpose of positioning the semiconductor member by examining it.

REFERENCES:
patent: 3571796 (1971-03-01), Brugger
patent: 3752589 (1973-08-01), Kobayashi
patent: 3778131 (1973-12-01), Wanesky
patent: 4075605 (1978-02-01), Hilley et al.
Khoury, H. H. "2-D Area Array Solid-State Feedback Automatic Wafer Alignment System", IBM Tech. Disc. Bull. 3-1975, pp. 2890-2892.
Reich et al., "High Speed Profile Measurement with Electro-Optics", Optical Engineering, vol. 15, 1,2-76, pp. 44-47.

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