Method of positioning a beam to a specific portion of a semicond

Boots – shoes – and leggings

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2504911, 356401, 364491, G01B 1127, G01N 23223, G06F 1560

Patent

active

046369686

ABSTRACT:
A method of positioning a beam to a specific portion of a semiconductor wafer is disclosed. In this method, the positions of two positioning marks formed on the wafer are measured. The position of another of the marks is calculated. Then, an actual position of the mark is measured. The calculated position and the actual position are compared with each other. It is judged whether or not the mark satisfies a predetermined condition. When the mark satisfies the predetermined condition, the specific portion of the semiconductor wafer is determined using the actual position of the mark. When it does not satisfy the predetermined condition, the specific area is determined using the position calculated using the positions of the marks around the mark.

REFERENCES:
patent: 4328553 (1982-05-01), Fredriksen et al.
patent: 4370059 (1983-01-01), Masuda
patent: 4423959 (1984-01-01), Nakazawa et al.
patent: 4433243 (1984-02-01), Nakamura et al.
patent: 4489241 (1984-12-01), Matsuda et al.
patent: 4550374 (1985-10-01), Meshman et al.
patent: 4558225 (1985-12-01), Gotou et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of positioning a beam to a specific portion of a semicond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of positioning a beam to a specific portion of a semicond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of positioning a beam to a specific portion of a semicond will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2360844

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.