Method of polishing wafers, a backing pad used therein, and meth

Details Method of polishing wafers, a backing pad used therein, and meth Method of polishing wafers, a backing pad used therein, and meth

1994-08-18

1996-11-12

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451287, 451364, 51293, B24B 3704

Patent

active

055734480

ABSTRACT:
A template-type wafer polishing method in which a plurality of wafers are polished while they are fitted in the corresponding number of circumferentially spaced engagement holes in a template blank, with the backsides of the respective wafers held by a backing pad, wherein the backing pad has, in its one surface next to the template blank, a plurality of annular grooves each extending along a corresponding one of the engagement grooves in the template blank for relieving a stress concentrated on the peripheral edge of each wafer. The polished wafer is free from deformation, such as declination caused at the peripheral edge thereof due to stress concentration and, hence, has an extremely high degree of flatness. The backing pad and a method of making the same are also disclosed.

REFERENCES:
patent: 3977130 (1976-08-01), Degner

Affiliated with

Also associated with

Rating

Method of polishing wafers, a backing pad used therein, and meth does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of polishing wafers, a backing pad used therein, and meth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of polishing wafers, a backing pad used therein, and meth will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-558599