Method of polishing thin film formed on substrate

Optics: measuring and testing – By polarized light examination

Reexamination Certificate

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C356S369000

Reexamination Certificate

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11128364

ABSTRACT:
A method for polishing a thin film formed on a substrate includes planarizing a thin film formed on a reference substrate by a CMP process such that the thin film remains on the reference substrate. After the planarizing, the thin film is cleaned, and then values of Δ and Ψ with respect to the cleaned thin film are measured by ellipsometry. A physical property of the thin film is determined based on the Δ and Ψ which have been measured by ellipsometry, and a polishing condition for an other substrate having a thin film to be polished is set based on physical property data which are obtained by the determining of the physical property.

REFERENCES:
patent: 6464563 (2002-10-01), Lensing
patent: 6510395 (2003-01-01), Stanke
patent: 6690473 (2004-02-01), Stanke et al.
patent: 6710889 (2004-03-01), Lee et al.
patent: 6917433 (2005-07-01), Levy et al.
patent: 6930771 (2005-08-01), Rosencwaig et al.
patent: 6939209 (2005-09-01), Tsuo et al.
patent: 6946394 (2005-09-01), Fielden et al.
patent: 6980300 (2005-12-01), Lensing et al.
patent: 2002/0022936 (2002-02-01), Stanke
patent: 2005/0254050 (2005-11-01), Fielden et al.
Alessandra Satta et al., “The Removal of Copper Oxides by Ethyl Alcohol Monitored In Situ by Spectroscopic Ellipsometry”, Journal of the Electrochemical Society, 150(5) G300-G306 (2003), 0013-4651/2003/150(5)/G300/7, The Electrochemical Society, Inc.
M. R. Baklanov et al., “Characterization of Cu surface cleaning by hydrogen plasma”, J. Vac. Sci. Technol. B., vol. 19, No. 4, Jul./Aug. 2001, 1071-1023/2001/19(4)/1/11, American Vacuum Society.

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