Method of polishing tape-shaped substrate and substrate for...

Details Method of polishing tape-shaped substrate and substrate for... Method of polishing tape-shaped substrate and substrate for...

2008-08-19

2010-10-12

McGinty, Douglas (Department: 1796)

Superconductor technology: apparatus, material, process

Processes of producing or treating high temperature...

Process of making wire, tape, cable, coil, or fiber

C505S433000, C505S434000, C505S813000, C505S230000, C505S232000, C505S236000, C505S239000

Reexamination Certificate

active

07811972

ABSTRACT:
A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7° or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel.

REFERENCES:
patent: 6114287 (2000-09-01), Lee et al.
patent: 2005/0016867 (2005-01-01), Kreiskott et al.
patent: 2009/0054243 (2009-02-01), Horie et al.
patent: 2009/0163122 (2009-06-01), Watanabe et al.
patent: 2008016073 (2008-01-01), None
patent: 2008036724 (2008-02-01), None
patent: 2008049451 (2008-03-01), None
patent: WO 2008004601 (2008-01-01), None
patent: WO 2008023782 (2008-02-01), None

Affiliated with

Also associated with

Rating

Method of polishing tape-shaped substrate and substrate for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of polishing tape-shaped substrate and substrate for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of polishing tape-shaped substrate and substrate for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4181960