Method of polishing semiconductor wafer

Details Method of polishing semiconductor wafer Method of polishing semiconductor wafer

2005-11-29

2005-11-29

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S059000, C451S526000

Reexamination Certificate

active

06969304

ABSTRACT:
There is provided a method for polishing a semiconductor wafer, in which by using a specific polishing cloth as one for use in a mirror polishing step for the semiconductor wafer, especially in a final polishing stage thereof, generation of micro-scratches and blind scratches on a wafer surface is prevented. In a polishing step of mirror polishing the semiconductor wafer using a polishing cloth, the polishing is performed using the polishing cloth with a nap layer of 500 μm or more in thickness.

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patent: 07-108454 (1995-04-01), None
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patent: 97/47433 (1997-12-01), None
patent: 00/53370 (2000-12-01), None
International Search Report on PCT/JP01/06775 mailed on Nov. 13, 2001.
International Preliminary Examination Report mailed on Apr. 4, 2003.

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