Method of polishing semiconductor wafer

Details Method of polishing semiconductor wafer Method of polishing semiconductor wafer

1991-10-25

1993-03-09

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

511313, 511314, 51237R, B24B 3704

Patent

active

051917386

ABSTRACT:
A method of polishing a semiconductor wafer, wherein the semiconductor wafer bonded to a plate is polished to a desired thickness by pressing the semiconductor wafer against a rotating turntable side, and at the same time, a thickness regulating member, whose surface layer is made of a material slower to polish than the semiconductor wafer, is arranged on the plane of the plate to control the thickness of the semiconductor wafer. The matrix of the thickness regulating member is made of silicon and the surface layer facing said turntable is a silicon oxide film.

REFERENCES:
patent: 2979868 (1961-04-01), Emeis
patent: 3559346 (1971-02-01), Paola
patent: 4104099 (1978-08-01), Scherrer
patent: 4165584 (1979-08-01), Scherrer
patent: 4910155 (1990-03-01), Cote et al.

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