Method of polishing or planarizing a substrate

Details Method of polishing or planarizing a substrate Method of polishing or planarizing a substrate

2005-03-29

2005-03-29

Chen, Kin-Chan (Department: 1765)

Compositions

Etching or brightening compositions

C438S691000

Reexamination Certificate

active

06872328

ABSTRACT:
A method of polishing or planarizing a substrate comprising abrading at least a portion of the surface of a substrate comprising a metal, metal oxide, metal composite, or mixture thereof, with a composition comprising a metal oxide abrasive and a liquid carrier, wherein the composition has a pH of about 7 or less and the metal oxide abrasive has a total surface hydroxyl group density no greater than about 3 hydroxyl groups per nm2.

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