Method of polishing film to be polished

Details Method of polishing film to be polished Method of polishing film to be polished

2008-01-08

2008-01-08

Norton, Napine (Department: 1765)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C216S094000, C216S089000, C451S029000, C438S006000

Reexamination Certificate

active

07316786

ABSTRACT:
A method is provided that includes a main laminate making step of forming a plurality of main magnetic poles onto a substrate, covering each magnetic pole with a first protective film, and forming onto the first protective film a stopper film provided with openings at respective parts opposing the main magnetic poles. Each opening is wider than a planar width of a corresponding main magnetic pole, so as to make a main laminate. The method includes a main polishing step of polishing the first protective film and main magnetic poles through the openings of the stopper film in the main laminate by a CMP method. In the main laminate making step, the openings in the stopper film is provided with a width distribution.

REFERENCES:
patent: 2006/0132972 (2006-06-01), Tagami et al.
patent: A 8-102014 (1996-04-01), None
patent: A 9-246219 (1997-09-01), None

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