Method of polishing a wafer

Details Method of polishing a wafer Method of polishing a wafer

2006-02-24

2008-11-11

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C216S088000, C216S090000, C216S091000, C216S092000, C438S692000, C451S041000

Reexamination Certificate

active

07449124

ABSTRACT:
A method for polishing a wafer comprising an aqueous solution having a pH in the range of 6 to 8, wherein the aqueous solution comprises at least one compound selected from the group consisting of a polymethacrylic acid, a polysulfonic acid, and combinations thereof, and wherein the compound is present in the range of 1.5 to 4 percent by weight of the aqueous solution. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

REFERENCES:
patent: 5152917 (1992-10-01), Pieper et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 6194317 (2001-02-01), Kaisaki et al.
patent: 6294470 (2001-09-01), Economikos et al.
patent: 6368969 (2002-04-01), Economikos et al.
patent: 6485355 (2002-11-01), Economikos et al.
patent: 6569769 (2003-05-01), Economikos et al.
patent: 6863592 (2005-03-01), Lee et al.
patent: 6964923 (2005-11-01), Ronay
patent: 6997785 (2006-02-01), Rueb et al.
patent: 7238618 (2007-07-01), Mueller et al.
patent: 2002/0059755 (2002-05-01), Kido et al.
patent: 2002/0092423 (2002-07-01), Gillingham et al.
patent: 2005/0050803 (2005-03-01), Amanokura et al.
patent: 2005/0076581 (2005-04-01), Small et al.
patent: 2005/0153643 (2005-07-01), Simpson et al.
patent: 2005/0191823 (2005-09-01), Horikawa et al.
patent: 2006/0196848 (2006-09-01), Carter et al.
patent: 2006/0234509 (2006-10-01), Small et al.
Tonshoff et al., “Abrasive Machining of Silicon”,Annals of the International Institution for Production Engineering Research, vol. 39, 2, 1990, pp. 621-635.
Kondo et al., “Syntheses of novel fluorocarbon surfactants with oxyethylene groups”,Journal of Fluorine Chemistry, vol. 91 (1998) 147-151.

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