Method of polishing a substrate with a polishing system...

Details Method of polishing a substrate with a polishing system... Method of polishing a substrate with a polishing system...

2006-04-04

2006-04-04

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C156S922000, C051S308000, C438S005000

Reexamination Certificate

active

07021993

ABSTRACT:
The invention provides a method of polishing a substrate comprising (i) contacting a substrate with a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10S/cm to about 106S/cm, and (c) a liquid carrier, and (ii) abrading or removing at least a portion of the substrate to polish the substrate.

REFERENCES:
patent: 4502981 (1985-03-01), Delannoy et al.
patent: 4839005 (1989-06-01), Katsumoto et al.
patent: 4983650 (1991-01-01), Sasaki
patent: 5188766 (1993-02-01), Eiffler
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5352277 (1994-10-01), Sasaki
patent: 5489233 (1996-02-01), Cook et al.
patent: 5520849 (1996-05-01), Eiffler
patent: 5522965 (1996-06-01), Chisholm et al.
patent: 5527423 (1996-06-01), Neville et al.
patent: 5595689 (1997-01-01), Kulkarni et al.
patent: 5637185 (1997-06-01), Murarka et al.
patent: 5860848 (1999-01-01), Loncki et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 6062968 (2000-05-01), Sevilla et al.
patent: 6117000 (2000-09-01), Anjur et al.
patent: 6126532 (2000-10-01), Sevilla et al.
patent: 6303049 (2001-10-01), Lee et al.
patent: 6328874 (2001-12-01), Kinlen et al.
patent: 6348076 (2002-02-01), Canaperi et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 2002/0119286 (2002-08-01), Chen et al.
patent: 0 398 580 (1990-11-01), None
patent: 0 919 602 (1999-06-01), None
patent: 0 840 664 (2001-03-01), None
patent: 09020884 (1997-01-01), None

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