Method of polishing a layer using a polishing pad

Details Method of polishing a layer using a polishing pad Method of polishing a layer using a polishing pad

2011-07-26

2011-07-26

Rose, Robert (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S527000

Reexamination Certificate

active

07985122

ABSTRACT:
A tool for forming a desired pattern on a polishing pad establishes a vibration that is coupled to the polishing pad. The vibration removes small portions of the polishing pad according to the desired pattern. The polishing pad is then used in a chemical mechanical polishing (CMP) step to polish a layer on a semiconductor device.

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patent: 6875096 (2005-04-01), Park et al.
patent: 7029365 (2006-04-01), Chang et al.

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