Method of plating solder onto printed circuit boards

Details Method of plating solder onto printed circuit boards Method of plating solder onto printed circuit boards

1980-01-21

1981-12-08

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

043046401

ABSTRACT:
In a method of electro-plating solder onto selected areas of the conductors of a printed circuit board, the following steps are followed: a continuous conductive surface is formed on a board carrying circuit conductors, a mask is formed on the surface to leave predetermined exposed areas, solder is electroplated on the said areas, and the mask and the remaining conductive surface are removed. The method is suitable for the plating of through holes in the board to connect conductors on the two sides of the board.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser
patent: 2897409 (1959-07-01), Gitto
patent: 3208921 (1965-09-01), Hill
patent: 3296099 (1967-01-01), Dinella
patent: 3306830 (1967-02-01), Bittrich
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3819497 (1974-06-01), Grunwald
patent: 3873429 (1975-03-01), Brown

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