Chemistry: electrical and wave energy – Processes and products
Patent
1985-07-17
1987-06-16
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
204 20, 204 30, 204 40, 204 521, C25D 510
Patent
active
046734694
ABSTRACT:
A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with the substrate for the passage of electrical current therebetween; electrolessly depositing a thin layer of metal selected from the group consisting of copper, nickel, cobalt and mixtures thereof on a surface of the plastic substrate; positioning the supported substrate in an electroplating bath including from about 10.0 to about 45.0 g/l of copper ions, at least one acid selected from the group consisting of sulfuric acid, fluoroboric acid and sulfamic acid, with the acid being present in an amount sufficient to cause the electroplating bath to have a conductivity ranging from about 0.40 to about 0.60 mhos and from about 30 to about 150 mg/l of chloride ions; and passing electrical current through the bath so as to cause a layer of copper to be electrolytically deposited over the layer of electrolessly deposited metal.
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Beach Sidney C.
Fellman Jack D.
Boggs Jr. B. J.
McGean-Rohco, Inc.
Niebling John F.
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