Method of plating a conductive substrate surface with silver

Details Method of plating a conductive substrate surface with silver Method of plating a conductive substrate surface with silver

1985-05-07

1986-05-06

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 321, 2041415, C25D 502, C25D 534, C25D 104

Patent

active

045869898

ABSTRACT:
A plated silver layer suitable for use as a bonding layer in thermocompression bonding of composite materials such as multi-layer printed circuit boards is produced on a conductive substrate surface by degreasing, scouring and wiping the surface to clean it after which it is subjected to anodic treatment in a bath of alkaline cyanide solution, rinsed in a bath having the same composition as the anodic treatment bath and then electroplated with silver.

REFERENCES:
patent: 2451341 (1948-10-01), Jernstedt
patent: 2678909 (1954-05-01), Jernstedt
patent: 3427232 (1969-02-01), Natwick
patent: 3661728 (1972-05-01), Toledo
patent: 3878065 (1975-04-01), Carr
patent: 4069110 (1978-01-01), Baboian
patent: 4127450 (1978-11-01), Azzerri

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