Method of plating a bonded magnet and a bonded magnet carrying a

Details Method of plating a bonded magnet and a bonded magnet carrying a Method of plating a bonded magnet and a bonded magnet carrying a

1992-03-04

1994-04-12

Niebling, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

205183, 205119, 205271, 205280, 428556, 428565, C23C 2800

Patent

active

053024648

ABSTRACT:
A closely adherent metal coating having a uniform thickness and substantially free from pinholes is formed on the porous surface of a bonded magnet to improve its oxidation and corrosion resistance without lowering its magnetic properties. The coating is formed by electroplating from an aqueous solution not containing chlorine, and having a pH of 5 or above. More particularly, the solution contains mainly nickel sulfate, an electrolyte in the form of an organic acid salt not containing chlorine, and a basic electrolyte not containing chlorine, and forms a nickel coating on the magnet surface.

REFERENCES:
patent: 4036709 (1977-07-01), Harbulak
patent: 4244790 (1981-01-01), Wieczerniak
patent: 4942098 (1990-07-01), Hamamura et al.
patent: 5013411 (1991-05-01), Minowa et al.
Chemical Abstracts 110:123875m Apr. 3, 1989.
Patent Abstracts of Japan, vol. 13, No. 246 (E-769) (3594) Jun. 8, 1989 of JP-A-10 48 404 (Seiko Epson) Feb. 22, 1989.

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