Method of plastically deforming a semiconductor device lead fram

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437249, H01L 2158, H01L 2160, H01L 21603, H01L 21607

Patent

active

052022897

ABSTRACT:
A method of manufacturing a semiconductor device comprising a lead frame (2A-2I) and a semiconductor crystal (3) provided on one of the conductors (2C) and comprising at least one semiconductor switching element, and electrically conducting connections (4A-4I from the crystal (3) to the conductors (2). The conductors (2) are stamped from a metal strip, after which the tag tips (2a) are coined between a coining die (8) and an anvil (6) to remove irregularities. After that, the conducting connections (4A-4I) are secured to the tag tips (2a) by ultrasonic welding. According to the invention, the anvil surface (5A) and the die surface (7) parallel thereto enclose a downward angle (.alpha.) with the adjoining portion (5B) of the anvil surface, which angle is preferably at least 0.50 and at most 5.degree..
The invention also relates to a device for carrying out the method, comprising an anvil (6) and a coining die (8), the anvil surface (5) comprising two adjoining flat portions (5A, 5B) which form an obtuse angle (.beta.) of preferably at least 175.degree. and at most 179.5.degree. enclosing the anvil material (6), the die surface (7) of the coining die (8) being practically parallel to one of the these portions (5A).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of plastically deforming a semiconductor device lead fram does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of plastically deforming a semiconductor device lead fram, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of plastically deforming a semiconductor device lead fram will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1155274

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.