Method of planarizing microstructures

Etching a substrate: processes – Planarizing a nonplanar surface

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216 59, 216 67, B44C 122, C03C 1500

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active

054198038

ABSTRACT:
A method of planarizing a microstructure (16) includes the steps of providing a layer (18) of material over the microstructure (16) such that an overcoating surface (20) is formed, measuring the thickness of the layer (18) across the surface (20) forming a dwell time versus position map and removing material from the layer (18) of material by use of a plasma assisted chemical etching tool in accordance with the dwell time versus position map.

REFERENCES:
patent: 4680084 (1987-07-01), Heimann et al.
patent: 5272115 (1993-12-01), Sato
patent: 5296092 (1994-03-01), Kim

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