Etching a substrate: processes – Planarizing a nonplanar surface
Patent
1993-11-17
1995-05-30
Powell, William
Etching a substrate: processes
Planarizing a nonplanar surface
216 59, 216 67, B44C 122, C03C 1500
Patent
active
054198038
ABSTRACT:
A method of planarizing a microstructure (16) includes the steps of providing a layer (18) of material over the microstructure (16) such that an overcoating surface (20) is formed, measuring the thickness of the layer (18) across the surface (20) forming a dwell time versus position map and removing material from the layer (18) of material by use of a plasma assisted chemical etching tool in accordance with the dwell time versus position map.
REFERENCES:
patent: 4680084 (1987-07-01), Heimann et al.
patent: 5272115 (1993-12-01), Sato
patent: 5296092 (1994-03-01), Kim
Denson-Low W. K.
Hughes Aircraft Company
Powell William
Schubert W. C.
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