Method of planarizing first pole piece layer of write head by la

Details Method of planarizing first pole piece layer of write head by la Method of planarizing first pole piece layer of write head by la

1999-06-25

2000-10-17

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

2960315, G11B 542

Patent

active

061312711

ABSTRACT:
A method planarizes a first pole piece layer of a write head by lapping without delaminating the first pole piece layer from an underlying second read gap layer on a wafer substrate. This is accomplished by separating or dicing the first pole piece material layer in a field region about rows and columns of first pole piece layers of magnetic head assemblies so as to reduce the stress of the first pole piece material layer in the field. Accordingly, when the wafer substrate is lapped, such as by chemical mechanical polishing (CMP), a reduced stress prevents the first pole piece material layer from delaminating from the second read gap layer during the lapping operation.

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