Method of planarizing a semiconductor workpiece surface

Details Method of planarizing a semiconductor workpiece surface Method of planarizing a semiconductor workpiece surface

1994-12-15

1997-10-21

Bowers, Jr., Charles L.

Fishing, trapping, and vermin destroying

437231, 437238, 437235, 437240, 437245, 437249, H01L 2131

Patent

active

056796102

ABSTRACT:
The present invention relates to a simple, low cost planarization technique whereby physical pressure is used to planarize the surface of a semiconductor device. The method of the present invention planarizes a semiconductor workpiece surface and results in an increase in the productivity of the processing steps that follow. In effect, the present invention applies physical pressure to flatten the surface layers of a semiconductor workpiece. The present invention is particularly adapted for use in planarizing surface layers made of plastic materials.

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