Method of placing a semiconductor with die collet having cavity

Details Method of placing a semiconductor with die collet having cavity Method of placing a semiconductor with die collet having cavity

1994-07-08

1995-05-16

Bradley, P. Austin

Metal fusion bonding

Process

With clamping or holding

228 62, H01L 2152, H01L 2168

Patent

active

054153310

ABSTRACT:
The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128. The method comprises providing a collet like the aforementioned; positioning the aperture 126 over a die 120; exerting a vacuum pressure through the vacuum port 128 to retain the die in the aperture such that a portion of the top side contacts the distally-facing surface 154 of the recess 152; positioning the die over the pad 144 such that the bottom side of the die is parallel to the pad; and discontinuing the vacuum pressure to release the die from the aperture.

REFERENCES:
patent: 3676911 (1972-07-01), Austin
patent: 4589586 (1986-05-01), Polansky
patent: 5231753 (1993-08-01), Tanaka et al.

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