Method of performing contactless photolithography

Details Method of performing contactless photolithography Method of performing contactless photolithography

1976-11-15

1978-05-09

Griffin, Donald

Photocopying

Contact printing

Methods

G03B 2702

Patent

active

040884066

ABSTRACT:
A semiconductor wafer vacuum chuck used as part of a photographic wafer-alignment machine for performing contactless photolithography has integral spacer means disposed on a substantially planar surface thereof for mechanically maintaining a fixed distance between portions of a wafer positioned adjacent the spacer means and the surface of the wafer chuck, whereby a controlled separation is provided between a surface of the wafer and a photographic mask overlying the surface of the wafer upon the application of a vacuum to the surface of the wafer chuck.

REFERENCES:
patent: 1602436 (1926-10-01), Jones
patent: 3597081 (1971-08-01), Cason et al.
patent: 3955163 (1976-05-01), Novak
I.B.M. Technical Disclosure Bulletin Vonkanel, vol. 6, No. 7, p. 61, 12/1963.

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