Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-05-16
2006-05-16
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C438S015000
Reexamination Certificate
active
07045387
ABSTRACT:
A method of performing back-end manufacturing of an integrated circuit (IC) device is disclosed. In one method embodiment, the present invention processes a die-strip through a front-of-line assembly portion which comprises a plurality of sub-stations operating on an in-line basis. The die-strip is then automatically provided to an end-of-line assembly portion. The die-strip is then processed through an end-of-line assembly portion which comprises a plurality of sub-stations operating on an in-line basis. The present embodiment then automatically provides the die-strip to a test assembly portion. The die-strip is then tested by the test portion and then automatically provided to a finish assembly portion. The present embodiment then processes the die-strip through a finish portion which comprises a plurality of sub-stations operating on an in-line basis. Camera systems perform automated visual inspection of dies on the die-strip and maintain a database that can be used for automated reject management.
REFERENCES:
patent: 6730545 (2004-05-01), Chang et al.
Chang Bo Soon
Rodgers Thurman J.
Cypress Semiconductor Corporation
Geyer Scott
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