Method of patterning resist for printed wiring board

Details Method of patterning resist for printed wiring board Method of patterning resist for printed wiring board

1985-06-10

1987-05-19

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Stripping process or element

430261, 430267, 430313, 430314, 430315, 430317, 430322, 430329, 430394, 430503, 204 15, G03C 1112, G03C 500

Patent

active

046668187

ABSTRACT:
A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing an octagonal aperture, is driven directly from a CAD system to expose the film on the board in the desired pattern without affecting the underlying UV sensitive layer. The film is then developed on the board and employed as an in situ mask for the underlying UV layer during exposure of the board to a UV flood lamp. After UV exposure the film is peeled off to allow conventional processing of the selectively polymerized layer. This technique produces high resolution, inspectable onboard masks in full registration using reliable low energy plotters.

REFERENCES:
patent: 3867150 (1975-02-01), Ketley
patent: 4168980 (1979-09-01), La Rossa
patent: 4327167 (1982-04-01), Tanabe
patent: 4347305 (1982-08-01), Shiba et al.
patent: 4373018 (1983-02-01), Reichmanis et al.
patent: 4469777 (1984-09-01), O'Neil
patent: 4515877 (1985-05-01), Barzynski et al.

Affiliated with

Also associated with

Rating

Method of patterning resist for printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of patterning resist for printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of patterning resist for printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1564500